Slicing resp. peeling in the range of µm.
In the industrial sectors like the information and communication technology, production of various electronic components, CMP pads / wafer and thermo conductive sheets among others, various types of resins resp. synthetic materials are used in a wide variety of constellations.
In close cooperation with our customers, we therefore developed and supplied our special slices for use in various high-tech industrial sectors for slicing resp. peeling special foams (Urethane, among others).

For example only:
    1. Slicing of High-performance rigid foam resin (rectangular block shape) – Slicing thickness 100µm ~ 300µm
    2. Slicing of High-performance laminated resin (square block shape) – Slicing thickness 100µm
    3. Slicing of High-performance laminated resin (round shape block) – Slicing thickness 100µm ~ 300µm

For further information incl. your individual requirements please use our contact form.